According to two new reports issued this week, while operators recognise the need to provide bundled service offerings, they have yet to determine how to change consumer buying habits and generate extra demand. Recent consumer market studies by Yankee Group and In-Stat show that consumers are not used to looking for a bundled service offering and are still most attracted by the lowest price available for a specific service. In-Stat reports that just 14 percent of potential residential customers in the US intend to sign-up for a bundled offering from a single service provider in the next twelve months, prompting a warning that operators need to better understand specific market segments and provide more targeted offerings. Commenting on what she described as �tepid at best� growth potential for bundled services, In-Stat analyst Amy Cravens said, �In order to better capitalise on the bundled opportunity, providers must offer a variety of package choices to match the appropriate services with different customers� needs.�
Few technology sectors sit as close to the center of gravity in today's artificial intelligence (AI) economy as semiconductor manufacturing. Every AI chip that trains a frontier model, every GPU that powers a data center inference workload, and every power management IC that keeps hyperscaler facilities running traces its origins back to the global Foundry ecosystem. IDC's latest market study throws that reality into sharp relief, projecting that the broadly defined Foundry 2.0 market will surpass $360 billion in 2026, a 17 percent year-over-year gain that would have seemed optimistic even two years ago. For anyone advising boards or investment committees on technology and AI infrastructure strategy, this growth trajectory demands careful consideration. Foundry 2.0 Market Development The umbrella term covers four distinct verticals: pure-play foundry, non-memory integrated device manufacturer (IDM) production, outsourced semiconductor assembly and test (OSAT), and photomask fab...