According to Informa, the global mobile market is forecast to pass 2 billion subs this year and be approaching 3 billion by the end of 2010. Overall market growth was boosted in 2004, with 91 million more new customers during the year than there were in 2003. Although the annual growth rate is forecast to fall into single figures within a couple of years, over one billion new subs are due to be added between now and the end of 2010. Almost half of these new subs will be in Asia Pacific. Two huge Asian markets -- India and China -- will account for over 30 percent (371.6 million) of the region's total. Amongst the regions, it is the Middle East and Africa markets that will show the greatest growth. Their combined markets will more than double in size, with over 200 million new customers signing up for mobile services by 2010. As a result of the continued growth, several countries are already reporting penetration rates of over 100 percent and Western Europe's regional penetration is set to breach 100 percent in a couple of years. By 2010, the global penetration is estimated at 43 percent.
The global digital business arena's relentless expansion drives an unprecedented surge in IT data center demand. This comes with a significant challenge: rising energy consumption costs. Based on the latest research, I've observed how this trend is reshaping the cloud computing industry and creating both obstacles and opportunities for leaders across the tech spectrum. Data centers are experiencing an infrastructure transformation, primarily fueled by the explosive growth of Artificial Intelligence (AI) workloads. Data Center Energy Market Development According to a recent IDC worldwide market study, AI data center capacity is projected to grow at a compound annual growth rate (CAGR) of 40.5 percent through 2027. This AI-driven demand is reshaping the data center sector and redefining the economics of IT infrastructure. "There are any number of options to increase data center efficiency, ranging from technological solutions like improved chip efficiency and liquid cooling