In both business and consumer markets, widespread adoption of Voice over Internet Protocol (VoIP) depends on the availability of wireless VoIP handsets, reports In-Stat. Dual-mode cellular/WiFi handsets will be the key driver to mass consumer adoption of VoIP. By 2009, In-Stat forecasts that over 66 million cellular/WiFi handsets will be in operation. �Wireless high-speed broadband access, unified messaging, video, and dual-network cellular/WiFi services are making the mobile triple play a consumer market reality,� says Keith Nissen, In-Stat analyst. �The key to successfully capturing the market for these next-generation personalized services is control of the end-point device.� Worldwide, consumer VoIP subscribers using wireless IP phones will grow from 2 percent currently to 73 percent in 2009. Based on competition from mobile carriers without wireline operations, Europe will be the largest initial market for dual-mode smartphones. While mass production of dual-mode sets is not scheduled until 2007, an In-Stat market survey found that over 80 percent of businesses have an interest in the technology.
The global digital business arena's relentless expansion drives an unprecedented surge in IT data center demand. This comes with a significant challenge: rising energy consumption costs. Based on the latest research, I've observed how this trend is reshaping the cloud computing industry and creating both obstacles and opportunities for leaders across the tech spectrum. Data centers are experiencing an infrastructure transformation, primarily fueled by the explosive growth of Artificial Intelligence (AI) workloads. Data Center Energy Market Development According to a recent IDC worldwide market study, AI data center capacity is projected to grow at a compound annual growth rate (CAGR) of 40.5 percent through 2027. This AI-driven demand is reshaping the data center sector and redefining the economics of IT infrastructure. "There are any number of options to increase data center efficiency, ranging from technological solutions like improved chip efficiency and liquid cooling