Digital Media Europe reports that French incumbent telco France Telecom and Swiss chip maker ST Microelectronics have announced a research and development (R&D) partnership to jointly analyse existing end-to-end telecommunications services and develop new solutions.
Their first joint project will be the analysis of advanced security solutions for mobile devices. Through the project they hope to develop architectural solutions for the next generation of mobile platforms to support operators' constraints and requirements for the deployment of future services. The project will address a variety of mobile device components, including applications processors, mobile operating systems, SIM Card ICs and contactless interfaces.
France Telecom and ST will also focus their efforts towards improving SIM Card IC architecture and its connectivity within mobile platforms. Specifically, they will work on multi-megabyte SIM memory capacities, high-speed SIM-to-mobile interfaces, SIM IC support for contactless operation and the use of SIM ICs as a dependable basis for platform architectures.
Through their partnership, the companies will combine France Telecom's experience in the telecoms industry with ST's technology to develop new telecoms solutions. The companies will work together to develop a secure and open environment for multimedia services and next-generation portable platforms. The long-term goal of the partnership is the development of a globally trusted platform architecture.
Their first joint project will be the analysis of advanced security solutions for mobile devices. Through the project they hope to develop architectural solutions for the next generation of mobile platforms to support operators' constraints and requirements for the deployment of future services. The project will address a variety of mobile device components, including applications processors, mobile operating systems, SIM Card ICs and contactless interfaces.
France Telecom and ST will also focus their efforts towards improving SIM Card IC architecture and its connectivity within mobile platforms. Specifically, they will work on multi-megabyte SIM memory capacities, high-speed SIM-to-mobile interfaces, SIM IC support for contactless operation and the use of SIM ICs as a dependable basis for platform architectures.
Through their partnership, the companies will combine France Telecom's experience in the telecoms industry with ST's technology to develop new telecoms solutions. The companies will work together to develop a secure and open environment for multimedia services and next-generation portable platforms. The long-term goal of the partnership is the development of a globally trusted platform architecture.