Recent teardown research from IDC's semiconductor analysts provides insight into the value chain for cutting-edge consumer electronics (CE) products, such as the Apple iPhone, the Apple TV, and the Slingbox AV. "Teardown research analyzes product bill of material (BOM) costs and, more importantly, allows us to witness technology adoption and integration trends firsthand," said IdaRose Sylvester, senior analyst for IDC semiconductor program. "It also allows us to evaluate the competitive supplier situation from one product generation to the next." IDC's teardown analysis of the iPhone reveals that many of its revolutionary features, including PDA functionality, strong multimedia playback, and Wi-Fi, are made possible by the semiconductor content found in the device. "As a result, IDC sees new opportunities for semiconductor companies to sell into the converged mobile device market, now that Apple has pushed these features to the consumer," added Syl